Department of Food, Agricultural and Biological Engineering

College of Food, Agricultural, and Environmental Sciences
College of Food, Agricultural, and Environmental Sciences
College of Engineering

Mohammad Shavezipur

Mohammad Shavezipur
Research Scientist
Office: 
205 Agricultural Engineering
Phone: 
614-247-7223

Research interests

  • Multiphysics finite element methods (FEM)
  • Contact properties in micro/nanoscale
  • High temperature electronics
  • Harsh environment Microelectromechanical systems (MEMS)
  • Microsystems for food and agricultural applications
  • Bio inspired micro/nanosystems

Refereed Journal Papers

Parsa, R., Lee, W. S., Shavezipur, M., Provine, J., Maboudian, R., Mitra, S., Wong, H.-S. P., Howe, R. T., “Laterally Actuated Platinum-Coated Polysilicon Nanoelectromechanical (NEM) Relays”, IEEE J. Microelectromechanical Sys., 2013, 11 pp, in press.

Shavezipur, M., Gou, W., Carraro, C., and Maboudian, R., “Characterization of Adhesion Force in MEMS at High Temperature using Thermally Actuated Microstructures”, IEEE J. Microelectromechanical Sys., 21(3), 2012, pp. 541-548.

Shavezipur, M., Gou, W., Carraro, C., and Maboudian, R., “Inline Measurement of Adhesion Force using Electrostatic Actuation and Capacitive Readout”, J. Microelectromechanical Sys. Lett., 21(4), 2012, pp. 768-770.

Laboriante, I., Farrokhzad, N., Fisch, M., Shavezipur, M., Carraro, C., Maboudian, R., Q. Bai, M. Liu, and S. Hoen, “Charging and Discharging Behavior in Dielectric-coated MEMS Electrodes Probed by Kelvin Probe Force Microscopy”, J.  Micromech. Microeng., 22(6), 2012, 065031, 9 pp.

Shavezipur, M., Nieva, P., Hashemi, S. M., and Khajepour, A., “Linearization and Tunability Improvement of MEMS Capacitors using Flexible Electrodes and Nonlinear Structural Stiffness”, J. Micromech. Microeng., 22, 2012, 025022, 10 pp.

Refereed Conference Papers

Shavezipur, M., Carraro, C., and Maboudian, R., “Effects of actuation methods and temperature on adhesion force between polycrystalline silicon surfaces in MEMS”, SPIE Photonic West 2013, San Francisco, USA, February 2-7, 2013, 6 pp, invited paper.

Shavezipur, M., Lee, W.S., Harrison, K., Provine, J., Mitra, S., Wong, H.-S. P., Howe, R.T., “Nanoelectromechanical Relays with Compliant, Low resistance Contact”, The 26th International Conference on Micro Electro Mechanical Systems, MEMS2013, Taipei, Taiwan, January 20-24, 2013, 4 pp.

Shavezipur, M., Kim, Y., Carraro, C., and Maboudian, R., “Silicon-based Gecko-inspired Adhesive Structures with Active and Passive Adhesion Control”, Technical Digest of Workshop on Technologies for Future Micro- Nano Manufacturing, MFG2011, Napa, California, USA, August 8-10, 2011, pp. 2778-2781.

Shavezipur, M., Li, G. H., Gou, W., Carraro, C., and Maboudian, R., “Measurement of Adhesion Force at Elevated Temperatures in MEMS using Thermal-Structural Actuation”, The 16th International Conference on Solid- State Sensors, Actuators and Microsystems, Transducers2011, Beijing, China, June 5-9, 2011, pp. 2414-2417.

Parsa, R., Shavezipur, M., Lee, W.S., Chong, S., Wong, H.-S. P., Maboudian, R., Howe, R.T., “Nanoelectromechanical Relays with Decoupled Electrode and Suspension”, The 24th International Conference on Micro Electro Mechanical Systems, MEMS2011, Cancun, Mexico, January 23-27, 2011, pp. 1361-1364.

Sohi, A. N., Shavezipur, M., Nieva, P., and Khajepour, A., “Modeling of a Multifunctional Pressure-Temperature Sensor”, ASME International Mechanical Engineering Congress and Exposition, Florida, FL, November 13-19, 2009, IMECE2009-12930, pp. 527-533.

Location: 
Columbus
Address: 
590 Woody Hayes Drive